GTAC | Imprint | Sitemap | Search | Internal
  »  Home   »  MPW & Prototyping   »  SiGe:C BiCMOS technologies 
englishgerman


   Low-Volume & Multi-Project Service

 

IHP offers research partners and customers access to its powerful SiGe:C BiCMOS technologies.

 

The technologies are especially suited for applications in the higher GHz bands (e.g. for wireless, broadband, radar). They provide integrated HBTs with cut-off frequencies of up to 300 GHz and integrated RF LDMOS devices with breakdown voltages of up to 22 V, including complementary devices.

 

The following SiGe:C BiCMOS technologies are available:

 

SG25H1:

A high-performance 0.25 µm technology with npn-HBTs up to fT/fmax= 180/220 GHz.

SG25H3:

A 0.25 µm technology with a set of npn-HBTs ranging from a higher RF performance (fT/fmax= 110 GHz/180 GHz) to higher breakdown voltages up to 7 V.

SG25H3P Module:

Additional pnp-HBTs with fT/fmax= 90 GHz/120 GHz are available.

SGB25V:

A cost-effective technology with a set of npn-HBTs up to a breakdown voltage of 7 V.

GOD-Module:

Additional integrated complementary RF LDMOS devices with breakdown voltages up to 22 V.

SG13S:

A high-performance 0.13 µm BiCMOS with npn-HBTs up to fT / fmax= 250 / 300 GHz, with 3.3 V I/O CMOS and 1.2 V logic CMOS.

SG13B:

Identical to SG13S but without 1.2 V logic CMOS.

 

The backend offers 3 (SG13S: 5) thin and 2 thick metal layers (TM1: 2 μm, TM2: 3 μm).

 

There is a schedule for the MPW & Prototyping runs.

 

A cadence-based mixed signal design kit is available. For high frequency designs an analogue Design Kit in ADS can be used. IHP’s reusable blocks and IPs for wireless and broadband are offered to support designs.

 

   Technical key-parameters of the technologies offered for
       MPW & Prototyping:

 

High-Performance 0.25 µm SiGe:C BiCMOS (SG25H1)

 

Parameter

npn1

npn2

Bipolar Section

AE

0.21 x 0.84 µm2

0.18 x 0.84 µm2

Peak fmax

190 GHz

220 GHz

Peak fT

190 GHz

180 GHz

BVCE0

1.9 V

1.9 V

BVCB0

4.5 V

4.5 V

VA

40 V

40 V

ß

200

200

 

0.25 µm SiGe:C BiCMOS with a set of npn-HBTs, ranging from high RF performance to higher breakdown voltages (SG25H3) PNP Module (SG25H3P)

 

Parameter

High Performance 1

Medium Voltage

High Voltage

pnp
H3P module

Bipolar Section

AE

0.22 x 0.84 µm2

0.22 x 2.24 µm2

0.22 x 2.24 µm2

0.21 x 0.84 µm2

Peak fmax

180 GHz

140 GHz

80 GHz

120 GHz

Peak fT

110 GHz

45 GHz

30 GHz

90 GHz

BVCE0

2.3 V

5 V

>7 V

-2.5 V

BVCB0

6.0 V

15.5 V

21.0 V

-4.0 V

VA

30 V

30 V

30 V

30 V

ß

150

150

150

100

 

0.25 µm SiGe:C BiCMOS with High-Voltage Devices (SGB25V)

 

Parameter

High Performance

Standard

High Voltage

Bipolar Section

AE

0.42 x 0.84 µm2

0.42 x 0.84 µm2

0.42 x 0.84 µm2

Peak fmax

95 GHz

90 GHz

70 GHz

Peak fT

75 GHz

45 GHz

25 GHz

BVCE0

2.4 V

4.0 V

7.0 V

BVCB0

>7 V

>15 V

>20 V

VA

>50 V

>80 V

>100 V

ß

190

190

190

 

GOD-Module in SGB25V


 

n-LDMOS

p-LDMOS

 

NLD3GD22C

INLD3GD13A****

PLD3GD19B

BVDSS*

22 V

13 V

-19 V

IDsat**

150 µA/µm

(VGS = 1.5 V)

150 µA/µm

(VGS = 1.5 V)

-50 µA/µm

(VGS = -1.5 V)

Ileakage

< 15 pA/µm

(VDS = 16 V)

< 10 pA/µm

(VDS = 8V)

> -10 pA/µm

(VDS = -8 V)

RON

4 Ωmm

4 Ωmm

13 Ωmm

Peak fmax***

48 GHz

40 GHz

27 GHz

Peak fT***

18 GHz

23 GHz

9.5 GHz

* : @50 pA/µm, **: @VDS = 5 V , *** : @VDS= 4 V, **** : substrate isolated

Preliminary target parameters extracted from first prototype preparations.

The values given may differ from the final parameters.

 

CMOS and Passives of 0.25 µm and 0.13 µm Technologies

 

Parameter

SG25H1/H3*

SG13B/13S

SG13S

CMOS Section

Core Supply Voltage

2.5 V

3.3 V

1.2 V

nMOS Vth

0.6 V

0.65 V

0.49 V

nMOS IDsat

540 µA/µm

520 µA/µm

500 µA/µm

nMOS Ioff

3 pA/µm

10 pA/µm

500 pA/µm

pMOS Vth

-0.56 V

-0.61 V

-0.42 V

pMOS IDsat

-230 µA/µm

-220 µA/µm

-210 µA/µm

pMOS Ioff

-3 pA/µm

-10 pA/µm

-500 pA/µm

Passives

MIM Capacitor

1 fF/µm2

1.5 fF/µm2

N+ Poly Resistor

210 Ω/

-

P+ Poly Resistor

280 Ω/

335 Ω/

High Poly Resistor

1600 Ω/

750 Ω/

Varactor Cmax/Cmin

3

tbd.

Inductor Q@5.8 GHz (with PM2)

20 (1 nH), 15 (1.8 nH)

tbd.

Inductor Q@10 GHz (with TM2)

23 (0.7 nH), 22 (1 nH)

tbd.

* Parameters for SGB25V are similar.

 

0.13 μm SiGe:C BiCMOS SG13S, SG13B

 

Parameter

npn13P

npn13V

Bipolar Section

AE

0.12 x 0.48 µm2

0.18 x 1.02 µm2

Peak fmax

300 GHz

120 GHz

Peak fT

250 GHz

45 GHz

BVCE0

1.7 V

4 V

BVCB0

5.5 V

16 V

ß

500

450




print version



28-06-10
9th Workshop
High-Performance SiGe:C BiCMOS (September 22, 2010) and Tutorial IHP Design Kits (September 23-24, 2010)

[more]