Overview >>                      Pilot Line

 

Goals World - class prototyping and process R&D capability in wireless & broadband technologies

Motivation Circuit innovation requires stable baseline process.
Short fabrication times are required for high technology innovation speed.

Milestones Stabilisation and MPW access of full 0.13 µm BiCMOS process capability in the pilot line.

Delivery Silicon on time for the technology projects ”0.25 µm BiCMOS”, “MPW & Prototyping”, “LDMOS”, “DotFive HBT” and other scientific projects (after agreement about capacity and schedule between CR project and technology projects ). Delivery Silicon for engineering and manufacturing for external customers.

Delivery wafers for four 0.25 µm BiCMOS technologies (with several options) and for two 0.13 µm BiCMOS technologies (with several options) for the project “Shuttle Service” (Fab out):
January 31: Delivery wafers “Shuttle Service 0.25 µm Nov 13”
March 12, 17, 21, 29: Delivery wafers “Shuttle Service 0.25 µm Jan 22”
Apr/May 17, 2: Delivery wafers “Shuttle Service 0.13 µm Feb 12”
Jul 02, 07, 11: Delivery wafers “Shuttle Service 0.25 µm May 14”
Oct/Nov 30, 14 : Delivery wafers “Shuttle Service 0.13 µm Aug 27”
Nov 12, 17, 21, 29 : Delivery wafers “Shuttle Service 0.25 µm Sep 24”
Jan 31 (2010): Delivery wafers “Shuttle Service 0.25 µm Nov 12”
Jun 26: Delivery of various project lot for IEDM-papers
November: Certification DIN EN ISO 9001:2000

Definition of Success Customers satisfaction-delivery on time for all technology projects and MPW in quality and quantity. Accepted paper for IEDM based on processed wafers in the cleanroom.
Fab parameters are depending on annual budget
- Throughput equivalent of 50 waferstarts/week in 0.25 μm-BiCMOS - technology
- 85% up time for toolset, characterized by MTTR <12h for 80% and >24h for 4%
- Cycle time: 3 days/mask for frozen technologies with standard priority, less than 2 days/mask for frozen technologies with high priority