Technology Platform for Wireless and Broadband
Communication - Selected projects
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The research programs are realized by dint of the following project portfolio, which is regulary updated according to the content requirements as well as opportunities for co-operations and external funding. Industry and grant projects are acquired in such a manner as to serve the strategic goals of the IHP.
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Involved Department: Technology
0.13 µm BiCMOS Technologies more
RF LDMOS Integration more
Pilot Line more
Reliability more
Modeling & Design Kit more
MPW & Prototyping more
Glucose sensor development more
DOTFIVE more
Helios - Photonics Electronics functional Integration on CMOS more
print version
30-11-11
Success story of Dotfive[more]
10-05-11
Scientist from IHP organizes symposium at Spring Meeting of EMRS in Nice
[more]
03-03-11
FEI Tecnai Osiris Symposium am 30. März 2011 im IHP
[more]
28-02-11
Consortium claims SiGe frequency record
At the International Solid-State Circuits Conference, IHP GmbH and the University of Wuppertal presented the latest results of the DotFive project. ...
[more]
08-12-10
IHP presents new transistors and switches for hight frequency electronics.
IHP with two contributions at the International Electron Devices Meeting (IEDM) in San Francisco, CA.
[more]
01-12-10
HELIOS Shows Off Laser Silicon Progress
... Technical University of Valencia, the University of Barcelona and DAS Photonics, all of Spain; IHP and Berlin University of Technology, both of Germany; ...
[more]
01-12-10
Seeking Faster Devices At IEDM
Several sessions at the upcoming 2010 IEDM will focus in improvements in ... B. Heinemann and a team from IHP Microelectronics sought gains in fT and fMAX ...
[more]
27-09-10
2010 IEEE International Electron Devices Meeting (IEDM 2010)
San Francisco, CA USA
December 6 - 8, 2010 [more]
22-09-10
„ACADEMIC EXCHANGE AGREEMENT“ between IHP and Tohoku University, Japan
[more]
09-02-10
EU project DOTFIVE presents circuits operating up to 650GHz at ISSCC in San Francisco, USA on February 11, 2010 (International Solid-State Circuits Conference).
The chips were designed at University of Wuppertal and fabricated using IHP SiGe technology with highest HBT performance developed within the frame of the project.
[more]
[more news]
