Integration of functional GaN layers on the mainstream Si technology platform

The integration of new functional semiconductor layers like Gallium nitride (GaN) on the Si technology platform via heteroepitaxy is in the focus of the project to increase the performance and / or functionality of Silicon-based integrated circuits by future “system-on-chip (SoC)” solutions. Virtual GaN wafers on Si are furthermore of interest as low-cost technology enablers for other applications, e.g. solid state lighting, blue lasers as well as high power electronics. Special emphasize is devoted to the fundamental solid state physics of GaN heteroepitaxy processes.

IHP materials research department patented together with SILTRONIC AG the integration of functional semiconductor layers (including GaN) via tailored oxide heterostructures on Si substrates. The use of European 3^rd generation Synchrotron radiation facilities is a key competence to perform state-of-the-art materials science studies on the nano-scale.

The project is funded by SILTRONIC AG, ESRF, BESSY II & PETRA III, EU Marie Curie Program

• Wroclaw University of Technology (Poland)
• Paul Drude Institute Berlin (Germany)
• Brandenburg Technical University of Cottbus (Germany)

[1] L. Tarnawska, P. Zaumseil, M. A. Schubert, S. Okur, U. Ozgur, H. Morkoç, R. Paszkiewicz, P. Storck, and

     T. Schroeder, J. Appl. Phys. 111, 073509 (2012).

[2] P. Zaumseil, L. Tarnawska, P. Storck, T. Schroeder, J. Phys. D: Appl. Phys. 44, 315403 (2011).

[3] L. Tarnawska, A. Giussani, P. Zaumseil, M. A. Schubert, R. Paszkiewicz, O. Brandt, P. Storck, and T. Schroeder,

     J. Appl. Phys. 108, 063502 (2010).