Microelectronics for Society:
„More than Moore“ materials research for functionalized Silicon technologies
The integration of “More than Moore” modules in Silicon technologies, based on new materials and / or device concepts, is a complex task which requires expertise from many research fields. Activities in IHP materials research department cover therefore a broad range, including basic research on materials science as well as technology-related research on device and module integration:
Exploratory research: Materials science holds a great potential for groundbreaking progress in Silicon microelectronics. However, new materials need to fulfill multiple parameters for successful integration and this is the task of our “Exploratory research group”. The work of this team is currently strongly devoted to Graphene-related research.
Front end of line research: FEOL projects are usually based on the need for single crystalline, nowadays often strain engineered heterostructures on Silicon to make use of superior (opto)electronic properties with respect to standard Silicon. Currently, the integration of alternative semiconductor device concepts into Si mainstream technologies is intensively pursued in our department.
Back end of line research: BEOL integration concepts are focused to enable new functional modules in Silicon technologies without the need to consume expensive Silicon wafer area. Besides materials science properties, process integration aspects are very crucial steps towards success. IHP is currently working for example on embedded non-volatile memory RRAM concepts for extremely fast read / write applications in high frequency sensor networks as well as surface acoustic wave filter (SAW) integration for biomedical applications.
Please check out the various project pages for detailed information.