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BEOL - Back end of line

Back end of line research: BEOL integration concepts are focused to enable new functional modules in Silicon technologies without the need to consume expensive Silicon wafer area. Besides materials science properties, process integration aspects are very crucial steps towards success. IHP is currently working for example on embedded non-volatile memory RRAM concepts for extremely fast read / write applications in high frequency sensor networks as well as surface acoustic wave filter (SAW) integration for biomedical applications.

Contact

Dr. Christian Wenger

 

IHP 

Im Technologiepark 25

15236 Frankfurt (Oder)

Germany

 

Projects

Embedded RRAM

SAW Devices

The building and the infrastructure of the IHP were funded by the European Regional Development Fund of the European Union, funds of the Federal Government and also funds of the Federal State of Brandenburg.