The research pursues consequently a "More than Moore" strategy referring to ITRS (International Technology Roadmap for Semiconductors). Our work does not focus on challenges for scaled CMOS technologies, but on the research and development of technology modules, which extend functionality of CMOS technology considerably.
Basic technologies are 0.25 µm and 0.13 µm BiCMOS Technologies, which are used for research and services. The 0.13 µm BiCMOS Technology provides a relevant research and development environment for the "More than Moore" process module integration. Strategic research goals are THz-components, Si Photonik and MEMS (Microelectromechanical Systems), but also passive components with high quality and sensor technology.
Thereby we pursue a monolithic integration approach: the integration of the modules into BiCMOS basic technologies. This approach allows the combination of electronic with the functionality of the integrated modules on one chip. Thereby technology`s applications range for System-on-Chip is enlarged considerably. Based on 0.25 µm and 0.13 µm BiCMOS-platforms we develop innovative and performance-enhancing technology components for wireless and broadband communication and sensor technology. Furthermore these technologies are provided via our MPW and Prototyping Service to internal and external customers on an industry relevant level.
A strategic extension of this Research Program is the heterointegration of technologies in cooperations with external partners. An example is the combination of the Si-based IHP-technology with the III/V technology of the Ferdinand Braun Institute into an "On-Top-of-Chip" approach within the project HITEK to unify advantages of both technologies in applications.
MPW & Prototyping
Email (M. Schultze)
